The latest research study “Copper Foil Market: Global Industry Trends, Share, Size, Growth, Opportunity and Forecast 2023-2028” by IMARC Group, finds that the global copper foil market size reached US$ 5.7 Billion in 2022. Looking forward, IMARC Group expects the market to reach US$ 8.7 Billion by 2028, exhibiting a growth rate (CAGR) of 7% during 2023-2028.
Copper foil is a thin sheet of copper made through the electrodeposition process or rolling the copper sheet. Compared to aluminum foil, it provides improved flexibility and heat and thermal resistance. As a result, copper foil is widely used as an electric conductor for circuit boards, batteries, and solar energy appliances. It is also utilized in printed circuit boards (PCBs) that are incorporated into telecommunication devices, such as personal computers (PCs), tablets, and mobile phones.
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Copper Foil Market Trends and Drivers:
The market is primarily driven by the increasing sales of electronic devices. In addition, the improving 5G infrastructure due to the growing need for better connecting solutions represents another major growth-inducing factor.
Besides this, the market is further propelled by the escalating demand for electric vehicles (EVs) on account of rising greenhouse gas (GHG) emissions worldwide. Moreover, several key players are increasing product differentiation by improving the surface properties of the copper foil and developing new surface treatment coatings to expand their consumer base.
This, coupled with the increasing applications of copper foils in decorative materials, such as monasteries, gold signs, tile mosaic, and handicrafts, are also creating a positive market outlook across the globe.
Global Copper Foil Market 2023-2028 Analysis and Segmentation:
Competitive Landscape:
The competitive landscape of the market has been studied in the report with the detailed profiles of the key players operating in the market.
Copper Foil Companies:
Carl Schlenk AG, Chang Chun Group, Furukawa Electric Co. Ltd., ILJIN Materials Co. Ltd., JX Nippon Mining & Metals Corporation (ENEOS Holdings Inc.), LS Mtron Co. Ltd., Mitsui Mining & Smelting Co. Ltd., Nippon Denkai Ltd., Rogers Corporation, SKC Co. Ltd., Sumitomo Metal Mining Co. Ltd., Targray Technology International Inc. and UACJ Corporation.
The report has segmented the market on the basis of region, product type, application and end use industry.
Breakup by Product Type:
- Rolled Copper Foil
- Electrodeposited Copper Foil
Breakup by Application:
- Printed Circuit Boards
- Batteries
- Electromagnetic Shielding
- Others
Breakup by End Use Industry:
- Aerospace and Defense
- Automotive
- Building and Construction
- Electrical and Electronics
- Industrial Equipment
- Medical
- Others
Breakup by Region:
- North America: (United States, Canada)
- Asia Pacific: (China, Japan, India, South Korea, Australia, Indonesia, Others)
- Europe: (Germany, France, United Kingdom, Italy, Spain, Russia, Others)
- Latin America: (Brazil, Mexico, Others)
- Middle East and Africa
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Key highlights of the report:
- Market Performance (2017-2022)
- Market Outlook (2023- 2028)
- Porter’s Five Forces Analysis
- Market Drivers and Success Factors
- SWOT Analysis
- Value Chain
- Comprehensive Mapping of the Competitive Landscape
If you need specific information that is not currently within the scope of the report, we can provide it to you as a part of the customization.
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